High Vacuum Metal Organic Evaporation Coating Machine

EV-400 High Vacuum Metal Organic Evaporation Coating Machine

Vacuum Chamber: Front-opening vacuum chamber for easy substrate handling, tungsten boat replacement, evaporation material loading, and daily maintenance;

Vacuum System: Domestic molecular pump as the main pump, with a vacuum limit better than 5.0×10⁻⁵Pa (after baking and degassing); alternatively, an imported magnetic levitation molecular pump or cryopump can be selected as the main pump, achieving a vacuum limit better than 3.0×10⁻⁶Pa (after baking and degassing);

Pumping Speed: Atmosphere to 8×10⁻⁴Pa ≤ 30 minutes;

Evaporation Sources: 4–6 sets of European/American technology metal or organic effusion cell evaporation sources available, enabling co-evaporation for composite films or sequential evaporation for multilayer films, with powerful functionality and stable performance;

Evaporation Power Supply: Professional vacuum evaporation power supply with constant current/power control. Current and power can be preset, featuring one-click start/stop automatic control;

Substrate Holder: Accommodates up to 120mm substrates or 25 pieces of 15–25mm ITO/FTO glass; customizable integrated high-precision etching mask plate; substrate holder rotates at 0–20r/min continuously adjustable speed;

Substrate Holder Functions: Substrate can be heated (room temperature to 300°C adjustable and controllable) or water-cooled; substrate holder can be raised/lowered; maximum source-to-substrate distance of 350mm;

Sputtering Power Supply: Optional DC pulse sputtering power supply or fully automatic matched RF sputtering power supply;

Thickness Monitor: Optional domestic or imported single water-cooled probe thickness monitor;

Coating Materials: Capable of depositing metals (Au, Ag, Al, Ca, Cu, Mg, Fe, Cr, Ti, Ni, etc.), non-metals, compounds (MoO₃, LiF, etc.), and organic materials; expandable to deposit single-layer, multilayer, and mixed films;

Control Method: PLC + touch screen control system with leak self-check and alerts, communication fault detection, and one-click vacuum pumping/stopping.